Bendable Flex PCB Board for wearable and foldable devices
Applications of Flexible PCB (FPC)
FPC eliminates the need for connectors and cables, boosting connection reliability, reducing assembly time/costs, and minimizing device size—its unique flexibility and durability make it widely used across industries:
◈ Wearable Devices: Smart watches, fitness trackers, etc.
◈ Mobile Phones: Supports folding/bending, saves space, reduces weight
◈ Automotive: Electronic door locks, airbag systems, fuel systems
◈ Medical Devices: Catheters, endoscopes
◈ Military: Communication/navigation systems
◈ Consumer Electronics: Laptops, game controllers
◈ Industrial: Robotics, automation systems
◈ FPC Antenna: Converts electric signals to electromagnetic waves for high-frequency long-range communication

Core Advantages: Redefining the Practical Value of Electronic Components
◈ Flexible Adaptation, Breaking Spatial Limitations: It can be freely bent, wound, and folded, and can be arbitrarily arranged according to the internal spatial layout of the device. It can flexibly move and expand in three-dimensional space, easily coping with complex installation scenarios, and freeing product design from the limitations of rigid circuits.
◈ Lightweight and Miniaturized, Optimizing Product Experience: Its volume and weight are far superior to traditional rigid PCB boards. It can significantly reduce the overall size and weight of electronic products, enhance portability, and perfectly meet the R&D needs of portable devices such as laptops, PDAs, and digital cameras.
◈ Stable and Reliable, Balancing Multiple Performances: It has good heat dissipation and solderability, with convenient assembly and controllable overall costs. Equipped with reinforcement materials such as FR4 and steel sheets, it can specifically improve local support strength; the rigid-flex combined design further makes up for the load-bearing shortcomings of flexible substrates, adapting to diverse usage scenarios.
◈ Superior Quality, Adapting to Strict Requirements: Adopting high-quality PI substrates, high-precision copper foil, and professional auxiliary materials, it is crafted through multiple precision processes. It has excellent bending resistance, heat resistance, and chemical resistance, and can stably cope with the harsh operating environments of high-end fields such as aerospace and military.
Flexible board Technology Capability
FR-4’s dominance in the European market—from industrial automation to automotive sectors—is due to its versatile profile:
Description |
Capability |
Layer Count |
1-16L |
Board Thickness |
0.05mm- - -0.75mm |
Copper Weight |
1/3,1/4 OZ, 2-7OZ (25-100um) |
Material |
DuPont, SHENGYI Tech, Taihong, SKC (KOREA) UBE, |
Surface Treatment |
OSP,ENIG(1u”-2u”), ENEPIG, Immersion silver, Immersion Tin |
Finished Product Size |
Min: 2*0.5mm, Max: 1000*500mm |
Min Holes |
0.1mm |
Min. Conductor Width/Space |
0.04/0.035mm(1.57/1.38mil) |
PI materail |
PI(0.1-0.275mm),Steel plate,304 steel plate,Steel plate with Ni plating(0.1-0.5),FR4(0.1-1.6) Copper plate,Al plate |
Profile Tolerance |
+/-0.1mm |

4L FPC
0.05mm circuits, ¢0.15mm hole size

4L FPC
0.075mm circuits, ¢0.2mm hole size
Impedance tolerances:+/-10%
At GT PCB, we value your time, and our fast turnaround time ensures that your projects stay on schedule. Our dedicated support team is here to assist you every step of the way, providing exceptional support, guidance, and technical expertise. Partner with us for your Flexible PCB Fabrication needs and experience the sincerity and naturalness that sets us apart.
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BGA & Fine-Pitch PCBA
Custom PCB Assembly
Flexible PCB Assembly
IC Programming
Low-Volume PCBA
Prototype PCB Assembly
Quick turn PCB Assembly
Rigid PCB Assembly
Rigid-flex PCB Assembly
