Comprehensive Functional Test And Inspection for production quality assurance

Overview of Functional Testing and Inspection Process Capability

Detection/testing type

Standard

Limit

AOI

Detect obvious defects such as wrong materials, missing parts, and offset.

Can detect 01005 components, with 3D detection and leg recognition capabilities.

SPI

Detect solder paste printing omissions, bridging, etc.

Can measure solder balls with a minimum size of 100 μm and an X-Y axis accuracy of 0.5 μm.

X-Ray / AXI

Detect virtual soldering and voids in hidden solder joints such as BGA.

Resolution up to 1 μm, rotatable multi view detection, identifying micrometer level defects.

ICT

Test the open/short circuit and component values of the circuit.

Supports>4096 test points for boundary scanning and power on function testing.

FCT

Verify the basic functions of the board level.

Simulate a real working environment, integrate temperature cycling testing (such as -60 ℃~125 ℃), communication protocol testing, etc.

3D

Measure component coplanarity, solder joint height, etc.

Using laser scanning with a repeatability accuracy of up to 0.3 μm, it is used for analyzing micro welding quality.