Flexible PCB Capability for wearable tech with ultra-thin layouts
Rigid PCB Technology Capabilities
Description |
Capability |
Layer Count |
1-6L |
Board Thickness |
0.05mm- - -0.75mm |
Copper Weight |
1/3,1/4 OZ, 2-7OZ (25-100um) |
Material |
DuPont, SHENGYI Tech, Taihong, SKC (KOREA) UBE, |
Surface Treatment |
OSP,ENIG(1u”-2u”), ENEPIG, Immersion silver, Immersion Tin |
Finished Product Size |
Min: 2*0.5mm, Max: 1000*500mm |
Min Holes |
0.1mm |
Min. Conductor Width/Space |
0.04/0.035mm(1.57/1.38mil) |
PI materail |
PI(0.1-0.275mm),Steel plate,304 steel plate,Steel plate with Ni plating(0.1-0.5),FR4(0.1-1.6) Copper plate,Al plate |
Profile Tolerance |
+/-0.1mm |
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BGA & Fine-Pitch PCBA
Custom PCB Assembly
Flexible PCB Assembly
IC Programming
Low-Volume PCBA
Prototype PCB Assembly
Quick turn PCB Assembly
Rigid PCB Assembly
Rigid-flex PCB Assembly
