Integrated Rigid‑flex PCB Assembly Capability for hinged electronic designs

process parameters	Rigid-Flex PCB
Minimum component packaging	Refer to the rigid area capability, but overall it is constrained by the flexible board area and affected by stress at the interface
Minimum IC pin spacing	The rigid area can reach 0.3mm, and the standards for the flexible area or joint need to be relaxed
BGA minimum ball spacing/ball diameter	0.3mm BGA can be attached to the rigid area, but it is not recommended to attach to the flexible area or bonding edge
Thickness	0.6mm - 2.4mm
Size	Flexible size design, but limited by the maximum size of the flexible part
SMT accuracy	High precision can be achieved in the rigid area, but the precision decreases in the fleible area
Peak temperature of reflow soldering	High precision can be achieved in the rigid area, but the precision decreases in the flexible board area
Key process characteristics	The design is complex and requires separate consideration of process compatibility between the rigid and flexible zones, with assembly stress management being the key.

Overview of Functional Testing and Inspection Process Capability
Detection/testing type	Standard	Limit
AOI	Detect obvious defects such as wrong materials, missing parts, and offset.	Can detect 01005 components, with 3D detection and leg recognition capabilities.
SPI	Detect solder paste printing omissions, bridging, etc.	Can measure solder balls with a minimum size of 100 μm and an X-Y axis accuracy of 0.5 μm.
X-Ray / AXI	Detect virtual soldering and voids in hidden solder joints such as BGA.	Resolution up to 1 μm, rotatable multi view detection, identifying micrometer level defects.
ICT	Test the open/short circuit and component values of the circuit.	Supports>4096 test points for boundary scanning and power on function testing.
FCT	Verify the basic functions of the board level.	Simulate a real working environment, integrate temperature cycling testing (such as -60 ℃~125 ℃), communication protocol testing, etc.
3D	Measure component coplanarity, solder joint height, etc.	Using laser scanning with a repeatability accuracy of up to 0.3 μm, it is used for analyzing micro welding quality.

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