Special PCB for Continuous Dynamic Bending Use
Key Characteristics
Neutral-layer routing and rounded trace designs are applied to eliminate stress concentration during movement. Equipped with precision laser drilling and high-adhesion coverlay bonding, the boards can withstand millions of bending cycles. Targeting foldable devices, mechanical rotating shafts and movable parts of wearables, every unit undergoes full-load simulation tests before delivery. We combine kinematics with circuit craftsmanship for exclusive customization, rather than following conventional flex board manufacturing modes. This niche high-end solution fully meets the strict durability requirements of modern foldable and movable electronic products.
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BGA & Fine-Pitch PCBA
Custom PCB Assembly
Flexible PCB Assembly
IC Programming
Low-Volume PCBA
Prototype PCB Assembly
Quick turn PCB Assembly
Rigid PCB Assembly
Rigid-flex PCB Assembly
