Standard Rigid PCB Assembly Capability for general‑purpose board stuffing at SMT lines

Process parameters

Rigid PCB

Minimum component packaging

Standard：0402 (1.0×0.5mm)

Limit：01005 (0.4×0.2mm) or 0201

Minimum IC pin spacing

Standard：0.4mm

Limit：0.3mm or 0.35mm

BGA minimum ball spacing/ball diameter

Standard：0.5mm

Limit：0.3mm

Thickness

Standard：0.8mm - 1.6mm

Limit：0.3mm - 6mm

Size

Standard： 70×70mm ~ 460×500mm

Limit： 900×600mm

SMT accuracy

Standard：±50μm

Limit：±22μm (3σ)

Peak temperature of reflow soldering

Standard：240℃±5℃ or 255℃±5℃

Limit：Supporting precise temperature control under nitrogen protection

Key process characteristics

The most mature process, good support, suitable for high-density and large-sized assembly.