Standard rigid PCB capability for general‑purpose boards
Rigid PCB Technology Capabilities
Description |
|
Capability |
Layer Count |
|
1-30L (HDI:1+n+1; 2+n+2,Anylayer HDI) |
Board Thickness |
|
0.2mm- - -5.0mm |
Copper Weight |
|
Inner: 6oz, Outer: 4oz |
Material |
|
FR4 (Kingboard,Shengyi,ITEQ,PTFE,ROGERS,ARLON,ISOLA,TACONIC, Nelco) Metal based board,(Aluminum, Copper base) CEM-1,CEM-2 Aluminum+FR4、PTFE+FR4, Rogers+ FR4 |
Surface Treatment |
|
HASL, HASL Lead free, OSP,ENIG(1u”-8u”),Hard Gol dplated up to50u”,Immersion silver, Immersion Tin, Carbon Ink LF HASL(+gold finger), Immersion Gold +gold fingers( hard gold),OSP +gold finger(hard gold), Immersion Tin +gold finger( hard gold) (Not two different surface finish) |
Finished Product Size |
|
Min: 5*5mm, Max: 1500*500mm |
Min Space of Drilling Holes to Conductor |
|
0.15mm(<8L); 0.2mm(8L<14L);0.225mm(<=24L) |
Min. Conductor Width/Space (Based copper) |
1/4OZ |
0.075mm/0.075mm |
1/3OZ |
0.075mm/0.09mm |
|
0.50Z |
0.10mm/0.10mm |
|
1 0Z |
0.15mm/0.15mm |
|
2 0Z |
0.20mm/0.20mm |
|
30Z |
0.254mm/0.30mm |
|
4 0Z |
0.305mm/0.40mm |
|
5OZ |
0.40mm/0.45mm |
|
The tolerance Conductor Width/Space |
±20% |
|
Min Size of Solder PAD/Annulus |
|
Pad:0.4mm/0.3mm(Laser dill), Annulus:0.1mm |
Profile Tolerance |
|
+/-0.15mm(Routing), +/-0.1mm(Punching) |
Min Space from Conductor/Holes to Edge |
|
0.15mm/0.2mm |
Warp & Twist |
|
0.3%-0.7% |
Thickness of Peelablemask |
|
0.2-0.5mm (Max plugging holes: 4.5mm) |
Bevel angle of gold finger |
|
20,30,45,60(Tolerance:+/-5degree) |
Impedance tolerance |
|
Single ended: 50-90 ohms+/-5ohm; Differential:100-155ohms+/-10% |
Aspect Ratio |
|
12:1 |
Core Performance Highlights
◈.Structural Support
● Rigid structure resists deformation from component weight/assembly stress
● Moderate vibration resistance (suitable for industrial/automotive via fixed installation)
● Longer service life than flexible PCBs in static scenarios
◈. Electrical Transmission
● Stable dielectric properties (FR-4: 4.2-4.8) for high-speed signal integrity
● Precision impedance control (±10%) for high-frequency/RF circuits
● 1-40 layers with blind/buried vias/HDI for high-density interconnection
◈. Thermal Management
● Operating temp: -50℃ to +150℃ (Standard FR-4); 170-180℃ (High Tg)
● Thermal vias/conductive materials for efficient heat dissipation
● Low CTE (14-18 ppm/℃) to prevent delamination/cracking
◈. Mass Production Adaptability
● Supports 1-100,000+ pcs orders with cost advantages
● Fast delivery: 3-5 days (prototypes), 5-15 days (mass production)
● Customizable (board thickness, copper thickness, surface finish, etc.)
Key Product Advantages
◈ Stable & Reliable: Low failure rate for long-term continuous use (rigid structure + mature processes)
◈ Balanced Performance: Mechanical strength, electrical performance, thermal stability in one
◈ Cost-Effective: High production efficiency + flexible material selection
◈ Flexible Design: Supports multilayer, high-density, impedance-controlled designs
◈ Controllable Quality: Full-process inspection (AOI, Flying Probe) + international standards compliance
Key Applications
Our Rigid PCBs are widely used in:
◈ Consumer Electronics (Smartphones, Laptops, TVs, Wearables)
◈ Industrial Automation (Controllers, Sensors, Power Supplies)
◈ Automotive Electronics (Infotainment Systems, ADAS Modules, Engine Controls)
◈ Medical Devices (Diagnostic Equipment, Portable Healthcare Tools)
◈ Telecommunications (Routers, Switches, Base Stations)
◈ Aerospace & Defense (Avionics, Military Communication Devices)
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BGA & Fine-Pitch PCBA
Custom PCB Assembly
Flexible PCB Assembly
IC Programming
Low-Volume PCBA
Prototype PCB Assembly
Quick turn PCB Assembly
Rigid PCB Assembly
Rigid-flex PCB Assembly
