Aluminum Core PCB for Efficient Heat Dissipation

Key Characteristics

Our integrated lamination process strengthens the bonding between each layer, preventing delamination and electric leakage during long-term operation. It delivers sufficient heat conduction for LED lights and medium-low power power supplies, becoming a cost-effective niche solution for thermal management. Instead of pursuing extreme thermal conductivity blindly, we adjust material formulas according to actual power demands. It strikes a perfect balance among heat dissipation, weight and cost, serving specialized segments including lighting appliances and household electronics.

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