Bendable Flexible PCB Assembly Capability for wearable sensor integration

Process parameters

FPCB

Minimum component packaging

Standard：≥0402

Limit：0201

Minimum IC pin spacing

Standard：≥0.4mm，High requirement for flatness

Limit：0.3mm，Special fixtures and steel mesh are required

BGA minimum ball spacing/ball diameter

Standard：≥0.5mm

Limit：0.4mm，Need to address local deformation and heat dissipation

Thickness

Standard：0.1mm - 0.3mm

Limit：0.1mm - 0.4mm,including stiffener

Size

Standard：Width≥50mm， Length≥50mm

Limit：250×500mm

SMT accuracy

Standard：Low accuracy, easily affected by deformation

Limit：Using high-precision vehicles can achieve ±50μm

Peak temperature of reflow soldering

Standard：Strict temperature control is required to prevent FPC deformation and foaming

Limit：Adopting low stress curves and vehicles

Key process characteristics

Special vehicles (fixtures) must be used to fix and maintain flatness. There are strict requirements for the flatness (bending, twisting) of the board surface.