Integrated rigid‑flexible PCB capability for compact assemblies

Description

Capabilities

Range

2-10L (HDI:1+n+1; 2+n+2)

Board thickness

0.2mm- - -3.0mm

Copper Foil

Inner: 3oz,  Outer: 4oz

Material

FR4+PI

Surface treatment

HASL,HASLLeadfree,OSP，ENIG(1u”-8u”),

Hard Gold plated up to 50u”, Immersion silver,  Immersion Tin, Carbon Ink

Size of finished product

Min: 10*10mm,  Max: 1200*500mm

Min Laser drilling holes & pad

0.1mm, pad<0.1mm

Min space of drilling holes to conductor

0.15mm(<8L); 0.2mm(8L<14L);0.225mm(<=24L)

Min. conductor width/space

0.075/0.075mm(3/3mil)

Min size of solder PAD/Annulus

Pad:0.4mm/0.3mm(Laser dill),  Annulus:0.1mm

Min space from conductor/holes to edge

0.15mm/0.2mm

Warp & twist

0.3%-0.7%

Thickness of peelablemask

0.2-0.5mm (Max plugging holes: 4.5mm)

Bevel angle of gold finger

20，30，45，60(Tolerance:+/-5degree)

Impedance tolerance

 +/-5ohm(〈50ohm)；+/-10%(〉50ohm)

Max multi-press

〈=3

Ratio of board thickness/holes size

12：1