Low‑dielectric Teflon PCB for ultra‑high‑frequency communication

Teflon PCB, also known as Polytetrafluoroethylene (PTFE) PCB or High-Frequency/RF PCB, is a high-performance printed circuit board that uses polytetrafluoroethylene as the substrate material.

Common Application Scenarios

◈ High-Frequency Communication Equipment: 5G base stations, RF antennas, microwave components.
◈ Aerospace: Radar systems, satellite communication modules.
◈ Military Electronics: Missile guidance systems, electronic warfare equipment.
◈ Medical Equipment: High-precision imaging systems (e.g., MRI).

Key Manufacturing Processes

◈ Special Lamination Technology: Ensures strong bonding between PTFE and copper foil.
◈ Laser Drilling: Enables high-precision micro-via processing.
◈ Surface Treatment: Electroless nickel immersion gold (ENIG) to enhance solderability.

Comparison with Standard FR-4 PCB

Property	Teflon PCB	Standard FR-4 PCB
Dielectric Constant (Dk)	2.0–2.2 (low and stable)	4.0–4.5 (relatively high)
Dielectric Loss (Df)	<0.001 (very low)	~0.02 (relatively high)
High-Frequency Performance	Excellent (mmWave bands)	Poor (suitable for low frequencies)
Cost	High (material/process complexity)	Low
Manufacturing Difficulty	High (requires special processes)	Low (standard processes)