Standard Rigid PCB Board for general‑purpose electronics

Introduction to Our Rigid PCB Products
Rigid PCBs are the core of modern electronics, made from non-flexible insulating substrates (e.g., FR4) and copper foil. Unlike flexible PCBs, they cannot be bent after formation, providing stable mechanical support and electrical connections for components. Used in over 80% of consumer electronics, their multi-layer design is an electronics industry cornerstone.

Key layers: ◈ Substrate layer ◈ Copper layer ◈ Solder mask layer ◈ Silkscreen layer

Rigid PCB Technology Capabilities

Description	Capability
Layer Count	2-30L (HDI:1+n+1; 2+n+2)
Board Thickness	0.2mm- - -5.0mm
Copper Weight	Inner: 6oz, Outer: 4oz
Material	FR4 (Kingboard，Shengyi，ILM,ITEQ,PTFE,OGERS,ARLON,ISOLA,TACONIC,Nelco)
Surface Treatment	HASL, HASL Lead free, OSP，ENIG(1u”-8u”),HardGoldplatedupto50u”,
	Immersion silver, Immersion Tin, Carbon Ink
Finished Product Size	Min: 55mm, Max: 1500500mm
Min Space of Drilling Holes to Conductor	0.15mm(<8L); 0.2mm(8L<14L);0.225mm(<=24L)
Min. Conductor Width/Space	0.075/0.075mm(3/3mil)
Min Size of Solder PAD/Annulus	Pad:0.4mm/0.3mm(Laser dill), Annulus:0.1mm
Profile Tolerance	+/-0.15mm(Routing), +/-0.1mm(Punching)
Min Space from Conductor/Holes to Edge	0.15mm/0.2mm
Warp & Twist	0.3%-0.7%
Thickness of Peelablemask	0.2-0.5mm (Max plugging holes: 4.5mm)
Bevel angle of gold finger	20，30，45，60(Tolerance:+/-5degree)
Impedance tolerance	Single ended: 50-90ohms+/-5ohm; Differential:100-155ohms+/-10%
Aspect Ratio	12：1

Advantages of Rigid PCBs

Rigid PCBs offer unique benefits for high-performance applications, with core advantages summarized below:
◈ Mechanical Strength & Stability: Stiff substrate (e.g., FR4 fiberglass) resists warping, vibration, and shock, securing components and electrical connections—ideal for harsh environments like automotive/industrial systems.
◈ High Component Load Capacity: Supports large/heavy parts (transformers, heat sinks) without extra mounting hardware, reducing complexity and weight.
◈ Effective Thermal Management: FR4 or metal-core (aluminum) substrates, plus copper layers, dissipate heat from high-power components (CPUs, LEDs), boosting product reliability and lifespan.
◈ Cost-Effective Mass Production: Standardized, automated manufacturing cuts costs (3-5x cheaper than flexible PCBs), perfect for high-volume consumer electronics (smartphones, laptops).
◈ Simplified Design & Layout: Fewer constraints—easy routing, no bend-radius planning, straightforward layer stackup. Accelerates prototyping and shortens time-to-market.
◈ Easy Assembly & Testing: Flat, rigid surface enables accurate automated assembly (SMT/THT) and testing (AOI/ICT), improving production yields.