Universal Metal Core PCB for Various Heat Loads
Key Characteristics
Differentiated processes are applied in lamination, insulation coating and etching to adapt to various metal materials. The product covers full-gradient heat dissipation demands from civil medium-power components to industrial high-power modules. We focus on providing overall metal-core PCB solutions rather than simple product sales. For heat-generating electronic components across multiple niche industries, we match the most suitable metal substrate and manufacturing process.
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BGA & Fine-Pitch PCBA
Custom PCB Assembly
Flexible PCB Assembly
IC Programming
Low-Volume PCBA
Prototype PCB Assembly
Quick turn PCB Assembly
Rigid PCB Assembly
Rigid-flex PCB Assembly
